A fundamental aspect of Apple’s A-series and M-series processors is the System-on-a-Chip (SoC) design, which efficiently combines all components into a single package, encompassing both the CPU and GPU.
However, a recent report indicates that the M5 Pro chip might adopt a different strategy by featuring more distinct CPU and GPU components to enhance performance and improve production yields…
The System-on-a-Chip Structure
Previously, traditional computers separated the CPU (central processing unit) and GPU (graphics processing unit), often placing them on different circuit boards.
With the introduction of the iPhone, Apple opted for a design that merges the two into a System-on-a-Chip (SoC). This means that what would have been independent chips are now consolidated into a singular, compact component that integrates circuitry for both functions. This approach has also been mirrored in other devices, including the M-series chips for Apple Silicon Macs.
Whether we classify this as one chip or a compact assembly of multiple chips often comes down to interpretation, though Apple consistently refers to them as singular chips—like the A18 Pro and the M4 chip.
M5 Pro Chip Featuring Separate CPU and GPU
According to Apple analyst Ming-Chi Kuo, the M5 Pro chip will leverage TSMC’s latest chip packaging technology, known as SoIC-mH (System-on-Integrated-Chips-Molding-Horizontal).
The SoIC-mH technique allows for the integration of different chips into a single package in a manner that enhances thermal performance, enabling the chip to operate at full capacity for a longer duration before it requires throttling to manage heat. Additionally, it is said to improve production yields by reducing the number of chips that fail quality control checks.
Kuo’s report indicates that this strategy will be applied to the M5 Pro, Max, and Ultra versions of the forthcoming M5 chip.
The M5 series chips will utilize TSMC’s advanced N3P node, which commenced its prototype phase a few months ago. Mass production for the M5, M5 Pro/Max, and M5 Ultra is anticipated in the first half of 2025, the second half of 2025, and 2026, respectively.
The M5 Pro, Max, and Ultra will employ server-grade SoIC packaging while harnessing 2.5D packaging known as SoIC-mH (molding horizontal) to enhance production yields and thermal performance, featuring separate CPU and GPU configurations.
Interestingly, earlier reports suggested that the iPhone 18 would also begin to differentiate various components of the A-series chip, particularly RAM, which is currently integrated within the chip.
Utilization in Apple Intelligence Servers
Kuo also mentioned that M5 Pro chips would be utilized within Apple Intelligence servers, referred to as Private Cloud Compute (PCC).
Apple’s PCC infrastructure expansion will gain momentum following the mass production of the high-end M5 chips, which are better suited for AI inferencing.
Image: Michael Bower/DMN
FTC: We use income earning auto affiliate links. More.
